Dr. MacDonald received his doctoral (2002) degree in Electrical and Computer Engineering from the University of Texas at Austin. He worked in industry for 12 years at IBM and Motorola and subsequently co-founded a start-up specializing in CAD software and the startup was acquired by a firm in Silicon Valley. Dr. MacDonald spent 2003 to 2016 at the University of Texas at El Paso as the associate director of the W. M. Keck Center for 3D Innovation and held faculty fellowships at NASA’s Jet Propulsion Laboratory, US Navy Research and was awarded a US State Department Fulbright Fellowship in South America.

• Chilean Conocyt, Visiting Scholar at Universidad Santa Mariá - Chilean Government (06/01/2015-06/30/2015)
• Literati Network Award For Excellence 2013 - Emerald Publishing (05/01/2013-05/31/2013)
• ECE Department Award - Up and Coming Researcher - ECE Department (09/01/2010)
• Manuel Izquierdo Award for Teaching - ECE Department (09/01/2010)
• Recognition for Obtaining External Funding for Research - Office of Research and Sponsored Projects (05/01/2010)
• DARPA Design Subthreshold Logic Design Contest - DARPA (03/01/2010-03/31/2010)
• NASA JPL New Technology Award (NTA) 2005 - NASA (01/01/2005-01/31/2005)
• Fulbright Scholar, Fall 2011, Valpaaíso Chile - Department of State

• Ph D in Electrical Engineering, The University of Texas at Austin (2002)
• MS in Electrical Engineering, The University of Texas at Austin (1997)
• BS in Electrical Engineering, The University of Texas at Austin (1993)

• Folding behavior of thermoplastic hinges fabricated with polymer extrusion additive manufacturing (2019), Cesar O. Balderrama-Armendariz, Eric MacDonald, David A. Roberson, Leopoldo Ruiz-Huerta, Aide Maldonado-Macias, Esdras Valadez-Gutierrez, Alberto Caballero-Ruiz, David Espalin.
• Electronic gaming die (2018), Danny W. Muse, Ryan B. Wicker, Eric MacDonald, Rodolfo Salas, Francisco Medina.
• Fabricating patch antennas within complex dielectric structures through multi-process 3D printing (2018), Eric MacDonald, David Espalin, Derek Doyle, Jazmin Munoz, Steven Ambriz, Jose L. Coronel, Andrew Williams, Ryan B. Wicker.
• Torsion analysis of the anisotropic behavior of FDM technology (2018), O. Balderrama-Armendariz, Eric MacDonald, David Espalin, David Cortez-Saenz, Ryan B. Wicker, Aide Maldonado-Macias.
• Unobtrusive In Situ Diagnostics of Filament-Fed Material Extrusion Additive Manufacturing (2018), Chi Yen Kim, David Espalin, Alejandro Cuaron, Mireya A. Perez, Eric MacDonald, Ryan B. Wicker.
• 3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect (2017), Chi Yen Kim, David Espalin, Min Liang, Hao Xin, Alejandro Cuaron, Issac Varela, Eric MacDonald, Ryan B. Wicker.
• Method for connecting inter-layer conductors and components in 3D structures (2016), Ryan B. Wicker, Francisco Medina, Eric MacDonald, Danny W. Muse, David Espalin.
• 3D Printing of High Voltage Printed Wiring Boards (2016), Eric MacDonald, Ryan B. Wicker, David Espalin, Andy Kwas, Peter R. Kief.
• Multi-layer Archimedean spiral antenna fabricated using polymer extrusion 3D printing (2016), Corey M. Shemelya, Mike Zemba, Min Liang, Xiaoju Yu, David Espalin, Ryan B. Wicker, Hao Xin, Eric MacDonald.

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• ADDITIVE MANUFACTURING TOWARD ARBITRARY ELECTROMAGNETIC STRUCTURES
• Negative Stiffness Metamaterials